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1. general description the 74hc2g126; 74hct2g126 is a high-speed si-gate cmos device. the 74hc2g126; 74hct2g126 provides two non-inverting buffer/line drivers with 3-state output. the 3-state output is controlled by the output enable input pin noe. a low at pin noe causes the output to assume a high-impedance off-state. the bus driver output currents are equal compared to the 74hc126 and 74hct126. 2. features n wide operating voltage from 2.0 v to 6.0 v n symmetrical output impedance n high noise immunity n low power dissipation n balanced propagation delays n esd protection: u hbm jesd22-a114f exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n multiple package options n speci?ed from - 40 c to +85 c and - 40 c to +125 c 3. ordering information 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state rev. 04 24 september 2009 product data sheet table 1. ordering information type number package temperature range name description version 74hc2g126dp - 40 c to +125 c tssop8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm sot505-2 74hct2g126dp 74hc2g126dc - 40 c to +125 c vssop8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 74hct2g126dc 74hc2g126gd - 40 c to +125 c xson8u plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 2 0.5 mm sot996-2 74HCT2G126GD
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 2 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram 6. pinning information 6.1 pinning table 2. marking codes [1] type number marking code 74hc2g126dp h26 74hct2g126dp t26 74hc2g126dc h26 74hct2g126dc t26 74hc2g126gd h26 74HCT2G126GD t26 fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram (one driver) mna946 2a 1a 2oe 1oe 2 1 7 5 1y 2y 6 3 mna947 1 en1 1 6 2 7 3 5 mna127 oe a y fig 4. pin con?guration sot505-2 (tssop8) and sot765-1 (vssop8) fig 5. pin con?guration sot996-2 (xson8u) 74hc2g126 74hct2g126 1oe v cc 1a 2oe 2y 1y gnd 2a 001aad984 1 2 3 4 6 5 8 7 001aak029 74hc2g126 74hct2g126 transparent top view 8 7 6 5 1 2 3 4 1oe 1a 2y gnd v cc 2oe 1y 2a
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 3 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for tssop8 package: above 55 c the value of p tot derates linearly with 2.5 mw/k. for vssop8 package: above 110 c the value of p tot derates linearly with 8 mw/k. for xson8u package: above 118 c the value of p tot derates linearly with 7.8 mw/k. table 3. pin description symbol pin description 1oe, 2oe 1, 7 output enable input 1a, 2a 2, 5 data input 1y, 2y 6, 3 data output gnd 4 ground (0 v) v cc 8 supply voltage table 4. function table [1] input output noe na ny hl l hhh lxz table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v i ik input clamping current v i < - 0.5 v or v i >v cc + 0.5 v [1] - 20 ma i ok output clamping current v o < - 0.5 v or v o >v cc + 0.5 v [1] - 20 ma i o output current v o = - 0.5 v to (v cc + 0.5 v) [1] - 35 ma i cc supply current - 70 ma i gnd ground current - 70 - ma t stg storage temperature - 65 +150 c p tot total power dissipation [2] - 300 mw
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 4 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 9. recommended operating conditions 10. static characteristics table 6. recommended operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 74hc2g126 74hct2g126 unit min typ max min typ max v cc supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 v v i input voltage 0 - v cc 0-v cc v v o output voltage 0 - v cc 0-v cc v t amb ambient temperature - 40 +25 +125 - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 2.0 v - - 625 - - - ns/v v cc = 4.5 v - 1.67 139 - 1.67 139 ns/v v cc = 6.0 v - - 83 - - - ns/v table 7. static characteristics voltages are referenced to gnd (ground = 0 v). all typical values are measured at t amb =25 c. symbol parameter conditions t amb = - 40 c to +85 c t amb = - 40 c to +125 c unit min typ max min max 74hc2g126 v ih high-level input voltage v cc = 2.0 v 1.5 1.2 - 1.5 - v v cc = 4.5 v 3.15 2.4 - 3.15 - v v cc = 6.0 v 4.2 3.2 - 4.2 - v v il low-level input voltage v cc = 2.0 v - 0.8 0.5 - 0.5 v v cc = 4.5 v - 2.1 1.35 - 1.35 v v cc = 6.0 v - 2.8 1.8 - 1.8 v v oh high-level output voltage v i = v ih or v il i o = - 20 m a; v cc = 2.0 v 1.9 2.0 - 1.9 - v i o = - 20 m a; v cc = 4.5 v 4.4 4.5 - 4.4 - v i o = - 20 m a; v cc = 6.0 v 5.9 6.0 - 5.9 - v i o = - 6.0 ma; v cc = 4.5 v 3.84 4.32 - 3.7 - v i o = - 7.8 ma; v cc = 6.0 v 5.34 5.81 - 5.2 - v v ol low-level output voltage v i = v ih or v il i o = 20 m a; v cc = 2.0 v - 0 0.1 - 0.1 v i o = 20 m a; v cc = 4.5 v - 0 0.1 - 0.1 v i o = 20 m a; v cc = 6.0 v - 0 0.1 - 0.1 v i o = 6.0 ma; v cc = 4.5 v - 0.15 0.33 - 0.4 v i o = 7.8 ma; v cc = 6.0 v - 0.16 0.33 - 0.4 v i i input leakage current v i =v cc or gnd; v cc = 6.0 v - - 1.0 - 1.0 m a i oz off-state output current v i = v ih or v il ; v o =v cc or gnd; v cc = 6.0 v -- 5.0 - 10 m a
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 5 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 11. dynamic characteristics i cc supply current v i =v cc or gnd; i o =0a; v cc = 6.0 v - - 10 - 20 m a c i input capacitance - 1.0 - - - pf c o output capacitance - 1.5 - - - pf 74hct2g126 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 1.6 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - 1.2 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = - 20 m a 4.4 4.5 - 4.4 - v i o = - 6.0 ma 3.84 4.32 - 3.7 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 20 m a - 0 0.1 - 0.1 v i o = 6.0 ma - 0.16 0.33 - 0.4 v i i input leakage current v i =v cc or gnd; v cc = 5.5 v - - 1.0 - 1.0 m a i oz off-state output current v i = v ih or v il ; v o = v cc or gnd; v cc = 5.5 v -- 5.0 - 10 i cc supply current v i =v cc or gnd; i o =0a; v cc = 5.5 v - - 10 - 20 m a d i cc additional supply current per input; v cc = 4.5 v to 5.5 v; v i =v cc - 2.1 v; i o =0a - - 375 - 410 m a c i input capacitance - 1.0 - - - pf c o output capacitance - 1.5 - - - pf table 7. static characteristics continued voltages are referenced to gnd (ground = 0 v). all typical values are measured at t amb =25 c. symbol parameter conditions t amb = - 40 c to +85 c t amb = - 40 c to +125 c unit min typ max min max table 8. dynamic characteristics voltages are referenced to gnd (ground = 0 v); c l = 50 pf unless otherwise speci?ed; for test circuit see figure 8 . symbol parameter conditions t amb = - 40 c to +85 c t amb = - 40 c to +125 c unit min typ [1] max min max 74hc2g126 t pd propagation delay na to ny; see figure 6 [2] v cc = 2.0 v - 35 115 - 135 ns v cc = 4.5 v - 11 23 - 27 ns v cc = 5.0 v; c l =15pf - 10 - - - ns v cc = 6.0 v - 8 20 - 23 ns
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 6 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state [1] all typical values are measured at t amb = 25 c. [2] t pd is the same as t plh and t phl . t en is the same as t pzl and t pzh . t dis is the same as t plz and t phz . t t is the same as t thl and t tlh . [3] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; s (c l v cc 2 f o ) = sum of outputs. t en enable time noe to ny; see figure 7 [2] v cc = 2.0 v - 40 115 - 135 ns v cc = 4.5 v - 11 23 - 27 ns v cc = 6.0 v - 8 20 - 23 ns t dis disable time noe to ny; see figure 7 [2] v cc = 2.0 v - 25 125 - 150 ns v cc = 4.5 v - 12 25 - 30 ns v cc = 6.0 v - 10 21 - 26 ns t t transition time ny; see figure 6 [2] v cc = 2.0 v - 18 75 - 90 ns v cc = 4.5 v - 6 15 - 18 ns v cc = 6.0 v - 5 13 - 15 ns c pd power dissipation capacitance per buffer; v i = gnd to v cc [3] output enabled - 11 - - - pf output disabled - 1 - - - pf 74hct2g126 t pd propagation delay na to ny; see figure 6 [2] v cc = 4.5 v - 15 30 - 36 ns v cc = 5.0 v; c l =15pf - 12 - - - ns t en enable time noe to ny; see figure 7 ; v cc = 4.5 v [2] - 11 31 - 38 ns t dis disable time noe to ny; see figure 7 ; v cc = 4.5 v [2] - 11 35 - 42 ns t t transition time ny; see figure 6 ; v cc = 4.5 v [2] - 6 15 - 18 ns c pd power dissipation capacitance per buffer; v i = gnd to v cc - 1.5 v [3] output enabled - 11 - - - pf output disabled - 1 - - - pf table 8. dynamic characteristics continued voltages are referenced to gnd (ground = 0 v); c l = 50 pf unless otherwise speci?ed; for test circuit see figure 8 . symbol parameter conditions t amb = - 40 c to +85 c t amb = - 40 c to +125 c unit min typ [1] max min max
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 7 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 12. waveforms measurement points are given in t ab le 9 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. propagation delay input (na) to output (ny) and transition time output (ny) mna948 na input ny output t phl t plh gnd v i v m v oh v ol t thl t tlh v m v i 90% 10% measurement points are given in t ab le 9 . v ol and v oh are typical voltage output levels that occur with the output load. fig 7. enable and disable times mna949 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m table 9. measurement points type input output v m v m v x v y 74hc2g126 0.5v cc 0.5v cc v ol + 0.3 v v oh - 0.3 v 74hct2g126 1.3 v 1.3 v v ol + 0.3 v v oh - 0.3 v
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 8 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state test data is given in t ab le 10 . de?nitions test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. r l = load resistance. s1 = test selection switch. fig 8. test circuit for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aad983 dut v cc v cc v i v o r t r l s1 c l open g table 10. test data type input load s1 position v i t r , t f c l r l t phl , t plh t pzh , t phz t pzl , t plz 74hc2g126 gnd to v cc 6 ns 15 pf, 50 pf 1 k w open gnd v cc 74hct2g126 gnd to 3 v 6 ns 15 pf, 50 pf 1 k w open gnd v cc
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 9 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 13. package outline fig 9. package outline sot505-2 (tssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.95 0.75 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.70 0.35 8 0 0.13 0.1 0.2 0.5 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.47 0.33 sot505-2 - - - 02-01-16 w m b p d z e 0.25 14 8 5 q a 2 a 1 l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale tssop8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm sot505-2 1.1 pin 1 index
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 10 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state fig 10. package outline sot765-1 (vssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (2) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 0 0.13 0.1 0.2 0.4 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 q 0.21 0.19 sot765-1 mo-187 02-06-07 w m b p d z e 0.12 14 8 5 q a 2 a 1 q l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale vssop8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 1 pin 1 index
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 11 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state fig 11. package outline sot996-2 (xson8u) references outline version european projection issue date iec jedec jeita sot996-2 - - - - - - sot996-2 07-12-18 07-12-21 unit a max mm 0.5 0.05 0.00 0.35 0.15 3.1 2.9 0.5 1.5 0.5 0.3 0.6 0.4 0.1 0.05 a 1 dimensions (mm are the original dimensions) xson8u: plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 x 2 x 0.5 mm 0 1 2 mm scale b d 2.1 1.9 e e e 1 l l 1 0.15 0.05 l 2 v w 0.05 y y 1 0.1 c y c y 1 x b 14 85 e 1 e a c b v m c w m l 2 l 1 l terminal 1 index area b a d e detail x a a 1
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 12 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 14. abbreviations 15. revision history table 11. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model table 12. revision history document id release date data sheet status change notice supersedes 74hc_hct2g126_4 20090924 product data sheet - 74hc_hct2g126_3 modi?cations: ? t ab le 2 : marking codes table added. 74hc_hct2g126_3 20090507 product data sheet - 74hc_hct2g126_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? quick reference data removed ? added type numbers 74hc2g126gd and 74HCT2G126GD (xson8u package) ? section 8: derating factor for tssop8, vssop8 and xson8u package added 74hc_hct2g126_2 20051215 product data sheet - 74hc_hct2g126_1 74hc_hct2g126_1 20030303 product data sheet - -
74hc_hct2g126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 13 of 14 nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74hc2g126; 74hct2g126 dual buffer/line driver; 3-state ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 24 september 2009 document identifier: 74hc_hct2g126_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17 contact information. . . . . . . . . . . . . . . . . . . . . 13 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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